3D nanocomposites boost heat dissipation in electronics

3D nanocomposites boost heat dissipation in electronics
PromData – агенство промышленных и ценовых данных
27.10.2022
Scientists from Skoltech developed a self-assembled 3D nanocomposite with outstanding in-plane and out-of-plane heat conductivity, high electrical resistivity, and good hydrophobicity, which have a wide range of potential uses in packaging and electronics for thermal management applications. The study, describing scalable fabrication and composite properties, was published in Polymers.

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